View LTC2444_663049.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

FEATURES

LTC2444/LTC2445/ LTC2448/LTC2449 24-Bit High Speed 8-/16-Channel ADCs with Selectable Speed/Resolution DESCRIPTIO
The LTC(R)2444/LTC2445/LTC2448/LTC2449 are 8-/16channel (4-/8-differential) high speed 24-bit No Latency TM ADCs. They use a proprietary delta-sigma architecture enabling variable speed/resolution. Through a simple 4-wire serial interface, ten speed/resolution combinations 6.9Hz/280nVRMS to 3.5kHz/25VRMS (4kHz with external oscillator) can be selected with no latency between conversion results or shift in DC accuracy (offset, full-scale, linearity, drift). Additionally, a 2X speed mode can be selected enabling output rates up to 7kHz (8kHz if an external oscillator is used) with one cycle latency. Any combination of single-ended or differential inputs can be selected with a common mode input range from ground to VCC, independent of VREF. While operating in the 1X speed mode the first conversion following a new speed, resolution, or channel selection is valid. Since there is no settling time between conversions, all 8 differential channels can be scanned at a rate of 500Hz. At the conclusion of each conversion, the converter is internally reset eliminating any memory effects between successive conversions and assuring stability of the high order delta-sigma modulator.
, LTC and LT are registered trademarks of Linear Technology Corporation. No Latency is a trademark of Linear Technology Corporation.
Up to 8 Differential or 16 Single-Ended Input Channels Up to 8kHz Output Rate Up to 4kHz Multiplexing Rate Selectable Speed/Resolution 2VRMS Noise at 1.76kHz Output Rate 200nVRMS Noise at 13.8Hz Output Rate with Simultaneous 50/60Hz Rejection Guaranteed Modulator Stability and Lock-Up Immunity for any Input and Reference Conditions 0.0005% INL, No Missing Codes Autosleep Enables 20A Operation at 6.9Hz < 5V Offset (4.5V < VCC < 5.5V, - 40C to 85C) Differential Input and Differential Reference with GND to VCC Common Mode Range No Latency Mode, Each Conversion is Accurate Even After a New Channel is Selected Internal Oscillator--No External Components LTC2445/LTC2449 Include MUXOUT/ADCIN for External Buffering or Gain Tiny QFN 5mm x 7mm Package
APPLICATIO S

High Speed Multiplexing Weight Scales Auto Ranging 6-Digit DVMs Direct Temperature Measurement High Speed Data Acquisition
TYPICAL APPLICATIO
Simple 24-Bit Variable Speed Data Acquisition System
4.5V TO 5.5V 1F CH0 CH1 * * * CH7 CH8 * * * CH15 COM REF - GND LTC2448
2444 TA01
REF +
VCC FO
RMS NOISE (V)
= EXTERNAL OSCILLATOR = INTERNAL OSCILLATOR (SIMULTANEOUS 50Hz/60Hz REJECTION AT 6.9Hz OUTPUT RATE) 4-WIRE SPI INTERFACE
THERMOCOUPLE
16-CHANNEL MUX
+ -
VARIABLE SPEED/ RESOLUTION DIFFERENTIAL 24-BIT ADC
SDI SCK SDO CS
U
U
U
LTC2444/LTC2448 Speed vs RMS Noise
100 VCC = 5V VREF = 5V VIN+ = VIN- = 0V 2X SPEED MODE NO LATENCY MODE 2.8V AT 880Hz 280nV AT 6.9Hz (50/60Hz REJECTION)
10
1
0.1 1 1000 10 100 CONVERSION RATE (Hz) 10000
2440 TA02
sn2444589 2444589fs
1
LTC2444/LTC2445/ LTC2448/LTC2449
ABSOLUTE
(Notes 1, 2)
AXI U RATI GS
Operating Temperature Range LTC2444C/LTC2445C/ LTC2448C/LTC2449C .............................. 0C to 70C LTC2444I/LTC2445I/ LTC2448I/LTC2449I ........................... - 40C to 85C Storage Temperature Range ................. - 65C to 125C
Supply Voltage (VCC) to GND .......................- 0.3V to 6V Analog Input Pins Voltage to GND .................................... - 0.3V to (VCC + 0.3V) Reference Input Pins Voltage to GND .................................... - 0.3V to (VCC + 0.3V) Digital Input Voltage to GND ........ - 0.3V to (VCC + 0.3V) Digital Output Voltage to GND ..... - 0.3V to (VCC + 0.3V)
PACKAGE/ORDER I FOR ATIO
TOP VIEW
GND GND SDO SCK SDI CS FO
GND
38 37 36 35 34 33 32 GND 1 BUSY 2 EXT 3 GND 4 GND 5 GND 6 COM 7 NC 8 CH0 9 CH1 10 NC 11 NC 12 13 14 15 16 17 18 19
NC NC CH2 CH3 CH4 CH5 NC
31 GND 30 REF- 29 REF+ 28 VCC 27 NC 26 NC 25 NC 24 NC 23 NC 22 CH7 21 CH6 20 NC
LTC2444CUHF LTC2444IUHF
38 37 36 35 34 33 32 GND 1 BUSY 2 EXT 3 GND 4 GND 5 GND 6 COM 7 NC 8 31 GND 30 REF- 29 REF+ 28 VCC 27 MUXOUTN 26 ADCINN 25 ADCINP 24 MUXOUTP 23 NC 22 CH7 21 CH6 20 NC 13 14 15 16 17 18 19 NC NC CH2 CH3 CH4 CH5 NC
GND
SDO
SCK
SDI
CS
FO
ORDER PART NUMBER
QFN PART MARKING* 2444
UHF PACKAGE 38-LEAD (5mm x 7mm) PLASTIC QFN
TJMAX = 125C, JA = 34C/W
TOP VIEW
GND GND SDO SCK SDI CS FO
38 37 36 35 34 33 32 GND 1 BUSY 2 EXT 3 GND 4 GND 5 GND 6 COM 7 CH0 8 CH1 9 CH2 10 CH3 11 CH4 12 13 14 15 16 17 18 19
CH5 CH6 CH7 CH8 CH9 CH10 CH11
31 GND 30 REF- 29 REF+ 28 VCC 27 NC 26 NC 25 NC 24 NC 23 CH15 22 CH14 21 CH13 20 CH12
ORDER PART NUMBER LTC2448CUHF LTC2448IUHF
GND
38 37 36 35 34 33 32 GND 1 BUSY 2 EXT 3 GND 4 GND 5 GND 6 COM 7 CH0 8 31 GND 30 REF- 29 REF+ 28 VCC 27 MUXOUTN 26 ADCINN 25 ADCINP 24 MUXOUTP 23 CH15 22 CH14 21 CH13 20 CH12 13 14 15 16 17 18 19
GND
SDO
SCK
SDI
CS
FO
QFN PART MARKING* 2448
CH5
CH6
CH7
CH8
CH9
CH10
UHF PACKAGE 38-LEAD (5mm x 7mm) PLASTIC QFN
UHF PACKAGE 38-LEAD (5mm x 7mm) PLASTIC QFN
TJMAX = 125C, JA = 34C/W
TJMAX = 125C, JA = 34C/W
*The temperature grade is identified by a label on the shipping container. Consult LTC Marketing for parts specified with wider operating temperature ranges.
sn2444589 2444589fs
2
CH11
U
U
W
WW U
W
TOP VIEW
ORDER PART NUMBER LTC2445CUHF LTC2445IUHF
CH0 9 CH1 10 NC 11 NC 12
QFN PART MARKING* 2445
UHF PACKAGE 38-LEAD (5mm x 7mm) PLASTIC QFN
TJMAX = 125C, JA = 34C/W
TOP VIEW
ORDER PART NUMBER LTC2449CUHF LTC2449IUHF
CH1 9 CH2 10 CH3 11 CH4 12
QFN PART MARKING* 2449
LTC2444/LTC2445/ LTC2448/LTC2449
The denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Notes 3, 4)
PARAMETER Resolution (No Missing Codes) Integral Nonlinearity Offset Error Offset Error Drift Positive Full-Scale Error Positive Full-Scale Error Drift Negative Full-Scale Error Negative Full-Scale Error Drift Total Unadjusted Error CONDITIONS 0.1V VREF VCC, -0.5 * VREF VIN 0.5 * VREF, (Note 5) VCC = 5V, REF+ = 5V, REF- = GND, VINCM = 2.5V, (Note 6) REF+ = 2.5V, REF- = GND, VINCM = 1.25V, (Note 6) 2.5V REF+ VCC, REF- = GND, GND IN+ = IN- VCC (Note 12) 2.5V REF+ VCC, REF- = GND, GND IN+ = IN- VCC REF + = 5V, REF - = GND, IN + = 3.75V, IN - = 1.25V REF + = 2.5V, REF - = GND, IN + = 1.875V, IN - = 0.625V 2.5V REF+ VCC, REF- = GND, IN+ = 0.75REF+, IN- = 0.25 * REF+ REF + = 5V, REF - = GND, IN + = 1.25V, IN - = 3.75V REF + = 2.5V, REF - = GND, IN + = 0.625V, IN - = 1.875V 2.5V REF+ VCC, REF- = GND, IN+ = 0.25 * REF+, IN- = 0.75 * REF+ 5V VCC 5.5V, REF+ = 2.5V, REF- = GND, VINCM = 1.25V 5V VCC 5.5V, REF+ = 5V, REF- = GND, VINCM = 2.5V REF+ = 2.5V, REF- = GND, VINCM = 1.25V, (Note 6) 2.5V REF+ VCC, REF- = GND, GND IN- = IN+ VCC

ELECTRICAL CHARACTERISTICS
MIN 24
TYP 5 3 2.5 20 10 10 0.2 10 10 0.2 15 15 15 120
MAX 15 5
UNITS Bits ppm of VREF ppm of VREF V nV/C
50 50
ppm of VREF ppm of VREF ppm of VREF/C
50 50
ppm of VREF ppm of VREF ppm of VREF/C ppm of VREF ppm of VREF ppm of VREF dB
Input Common Mode Rejection DC
A ALOG I PUT A D REFERE CE The denotes specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25C. (Note 3)
SYMBOL IN+ IN- VIN REF+ REF- VREF CS(IN+) CS(IN-) CS(REF+) CS(REF-) IDC_LEAK(IN+, IN-,
REF+, REF-)
PARAMETER Absolute/Common Mode IN+ Voltage Absolute/Common Mode IN- Voltage Input Differential Voltage Range (IN+ - IN-) Absolute/Common Mode REF+ Voltage Absolute/Common Mode REF- Voltage Reference Differential Voltage Range (REF+ - REF-) IN+ Sampling Capacitance IN- Sampling Capacitance REF+ Sampling Capacitance REF- Sampling Capacitance Leakage Current, Inputs and Reference Average Input/Reference Current During Sampling MUX Break-Before-Make MUX Off Isolation
ISAMPLE(IN+, IN-,
REF+, REF-)
tOPEN QIRR
U
U
U
U
CONDITIONS

MIN GND - 0.3V GND - 0.3V -VREF/2 0.1 GND 0.1
TYP
MAX VCC + 0.3V VCC + 0.3V VREF/2 VCC VCC - 0.1V VCC
UNITS V V V V V V pF pF pF pF
2 2 2 2 CS = VCC, IN+ = GND, IN- REF+ = 5V, REF- = GND = GND,
-15
1
15
nA nA ns dB
Varies, See Applications Section 50 VIN = 2VP-P DC to 1.8MHz 120
sn2444589 2444589fs
3
LTC2444/LTC2445/ LTC2448/LTC2449
DIGITAL I PUTS A D DIGITAL OUTPUTS
SYMBOL VIH VIL VIH VIL IIN IIN CIN CIN VOH VOL VOH VOL IOZ PARAMETER High Level Input Voltage CS, FO Low Level Input Voltage CS, FO High Level Input Voltage SCK Low Level Input Voltage SCK Digital Input Current CS, FO, EXT, SOI Digital Input Current SCK Digital Input Capacitance CS, FO Digital Input Capacitance SCK High Level Output Voltage SDO, BUSY Low Level Output Voltage SDO, BUSY High Level Output Voltage SCK Low Level Output Voltage SCK Hi-Z Output Leakage SDO (Note 8) IO = -800A IO = 1.6mA IO = -800A (Note 9) IO = 1.6mA (Note 9)

The denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 3)
CONDITIONS 4.5V VCC 5.5V 4.5V VCC 5.5V 4.5V VCC 5.5V (Note 8) 4.5V VCC 5.5V (Note 8) 0V VIN VCC 0V VIN VCC (Note 8)

POWER REQUIRE E TS
SYMBOL VCC ICC PARAMETER Supply Voltage Supply Current Conversion Mode Sleep Mode
The denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 3)
CONDITIONS
TI I G CHARACTERISTICS
SYMBOL fEOSC tHEO tLEO tCONV PARAMETER External Oscillator Frequency Range External Oscillator High Period External Oscillator Low Period Conversion Time
The denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 3)
CONDITIONS

fISCK
Internal SCK Frequency
4
UW
U
U
MIN 2.5
TYP
MAX
UNITS V
0.8 2.5 0.8 -10 -10 10 10 VCC - 0.5V 0.4V VCC - 0.5V 0.4V -10 10 10 10
V V V A A pF pF V V V V A
MIN 4.5
TYP
MAX 5.5
UNITS V mA A
CS = 0V (Note 7) CS = VCC (Note 7)

8 8
11 30
UW
MIN 0.1 25 25 0.99 126
TYP
MAX 20 10000 10000
UNITS MHz ns ns ms ms ms
OSR = 256 (SDI = 0) OSR = 32768 (SDI = 1) External Oscillator (Notes 10, 13) Internal Oscillator (Note 9) External Oscillator (Notes 9, 10)

1.13 145
40 * OSR +170 fEOSC (kHz)
1.33 170
0.8
0.9 fEOSC/10
1
MHz Hz
sn2444589 2444589fs
LTC2444/LTC2445/ LTC2448/LTC2449
TI I G CHARACTERISTICS
SYMBOL DISCK fESCK tLESCK tHESCK tDOUT_ISCK tDOUT_ESCK t1 t2 t3 t4 tKQMAX tKQMIN t5 t6 t7 t8 PARAMETER Internal SCK Duty Cycle External SCK Frequency Range External SCK Low Period External SCK High Period Internal SCK 32-Bit Data Output Time External SCK 32-Bit Data Output Time CS to SDO Low Z CS to SDO High Z CS to SCK CS to SCK SCK to SDO Valid SDO Hold After SCK SCK Set-Up Before CS SCK Hold After CS SDI Setup Before SCK SDI Hold After SCK
The denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 3)
CONDITIONS (Note 9) (Note 8) (Note 8) (Note 8) Internal Oscillator (Notes 9, 11) External Oscillator (Notes 9, 10) (Note 8) (Note 12) (Note 12) (Note 9) (Notes 8, 12) (Note 5)

Note 1: Absolute Maximum Ratings are those values beyond which the life of the device may be impaired. Note 2: All voltage values are with respect to GND. Note 3: VCC = 4.5V to 5.5V unless otherwise specified. VREF = REF + - REF -, VREFCM = (REF + + REF -)/2; VIN = IN + - IN -, VINCM = (IN + + IN -)/2. Note 4: FO pin tied to GND or to external conversion clock source with fEOSC = 10MHz unless otherwise specified. Note 5: Guaranteed by design, not subject to test. Note 6: Integral nonlinearity is defined as the deviation of a code from a straight line passing through the actual endpoints of the transfer curve. The deviation is measured from the center of the quantization band.
PI FU CTIO S
GND (Pins 1, 4, 5, 6, 31, 32, 33): Ground. Multiple ground pins internally connected for optimum ground current flow and VCC decoupling. Connect each one of these pins to a common ground plane through a low impedance connection. All 7 pins must be connected to ground for proper operation. BUSY (Pin 2): Conversion in Progress Indicator. This pin is HIGH while the conversion is in progress and goes LOW indicating the conversion is complete and data is ready. It remains LOW during the sleep and data output states. At the conclusion of the data output state, it goes HIGH indicating a new conversion has begun. EXT (Pin 3): Internal/External SCK Selection Pin. This pin is used to select internal or external SCK for outputting/ inputting data. If EXT is tied low, the device is in the external SCK mode and data is shifted out of the device under the control of a user applied serial clock. If EXT is tied high, the internal serial clock mode is selected. The device generates its own SCK signal and outputs this on the SCK pin. A framing signal BUSY (Pin 2) goes low indicating data is being output. COM (Pin 7): The common negative input (IN -) for all single ended multiplexer configurations. The voltage on CH0-CH15 and COM pins can have any value between
sn2444589 2444589fs
U
U
UW
MIN 45 25 25 41.6
TYP
MAX 55 20
UNITS % MHz ns ns
35.3 320/fEOSC 32/fESCK
30.9
s s s ns ns s ns
0 0 5 25
25 25
25 15 50 50 10 10
ns ns ns ns ns ns
(Note 5) (Note 5)

Note 7: The converter uses the internal oscillator. Note 8: The converter is in external SCK mode of operation such that the SCK pin is used as a digital input. The frequency of the clock signal driving SCK during the data output is fESCK and is expressed in Hz. Note 9: The converter is in internal SCK mode of operation such that the SCK pin is used as a digital output. In this mode of operation, the SCK pin has a total equivalent load capacitance of CLOAD = 20pF. Note 10: The external oscillator is connected to the FO pin. The external oscillator frequency, fEOSC, is expressed in Hz. Note 11: The converter uses the internal oscillator. FO = 0V. Note 12: Guaranteed by design and test correlation. Note 13: There is an internal reset that adds an additional 1s (typ) to the conversion time.
U
5
LTC2444/LTC2445/ LTC2448/LTC2449
PI FU CTIO S
GND - 0.3V to VCC + 0.3V. Within these limits, the two selected inputs (IN+ and IN-) provide a bipolar input range (VIN = IN+ - IN-) from -0.5 * VREF to 0.5 * VREF. Outside this input range, the converter produces unique over-range and under-range output codes. CH0 to CH15 (Pins 8-23): LTC2448/LTC2449 Analog Inputs. May be programmed for single-ended or differential mode. CH0 to CH7 (Pins 9, 10, 13, 14, 17, 18, 21, 22): LTC2444/ LTC2445 Analog Inputs. May be programmed for singleended or differential mode. NC (Pins 8, 11, 12, 15, 16, 19, 20, 23): LTC2444/ LTC2445 No Connect/Channel Isolation Shield. May be left floating or tied to any voltage 0 to VCC in order to provide isolation for pairs of differential input channels. NC (Pins 24, 25, 26, 27): LTC2444/LTC2448 No Connect. These pins can either be tied to ground or left floating. MUXOUTP (Pin 24): LTC2445/LTC2449 Positive Multiplexer Output. Used to drive the input to an external buffer/ amplifier. ADCINP (Pin 25): LTC2445/LTC2449 Positive ADC Input. Tie to output of buffer/amplifier driven by MUXOUTP. ADCINN (Pin 26): LTC2445/LTC2449 Negative ADC Input. Tie to output of buffer/amplifier driven by MUXOUTN. MUXOUTN (Pin 27): LTC2445/LTC2449 Negative Multiplexer Output. Used to drive the input to an external buffer/ amplifier. VCC (Pin 28): Positive Supply Voltage. Bypass to GND with a 10F tantalum capacitor in parallel with a 0.1F ceramic capacitor as close to the part as possible. REF + (Pin 29), REF - (Pin 30): Differential Reference Input. The voltage on these pins can have any value between GND and VCC as long as the reference positive input, REF+, is maintained more positive than the negative reference input, REF+, by at least 0.1V. SDI (Pin 34): Serial Data Input. This pin is used to select the speed, 1X or 2X mode, resolution, and input channel, for the next conversion cycle. At initial power up, the default mode of operation is CH0-CH1, OSR of 256, and 1X mode. The serial data input contains an enable bit which determines if a new channel/speed is selected. If this bit is low the following conversion remains at the same speed and selected channel. The serial data input is applied to the device under control of the serial clock (SCK) during the data output cycle. The first conversion following a new channel/speed is valid. FO (Pin 35): Frequency Control Pin. Digital input that controls the internal conversion clock. When FO is connected to VCC or GND, the converter uses its internal oscillator running at 9MHz. The conversion rate is determined by the selected OSR such that tCONV (ms) = 40 * OSR + 170/fOSC (kHz). The first digital filter null is located at 8/tCONV, 7kHz at OSR = 256 and 55Hz (Simultaneous 50/ 60Hz) at OSR = 32768. This pin may be driven with a maximum external clock of 10.24MHz resulting in a maximum 8kHz output rate (OSR = 64, 2X Mode). CS (Pin 36): Active Low Chip Select. A LOW on this pin enables the SDO ditital output and wakes up the ADC. Following each conversion the ADC automatically enters the sleep mode and remains in this low power state as long as CS is HIGH. A LOW-to-HIGH transition on CS during the Data Output aborts the data transfer and starts a new conversion. SDO (Pin 37): Three-State Digital Output. During the data output period, this pin is used as serial data output. When the chip select CS is HIGH (CS = VCC) the SDO pin is in a high impedance state. During the conversion and sleep periods, this pin is used as the conversion status output. The conversion status can be observed by pulling CS LOW. This signal is HIGH while the conversion is in progress and goes LOW once the conversion is complete. SCK (Pin 38): Bidirectional Digital Clock Pin. In internal serial clock operation mode, SCK is used as a digital output for the internal serial interface clock during the data output period. In the external serial clock operation mode, SCK is used as the digital input for the external serial interface clock during the data output period. The serial clock operation mode is determined by the logic level applied to the EXT pin.
sn2444589 2444589fs
6
U
U
U
LTC2444/LTC2445/ LTC2448/LTC2449
FU CTIO AL BLOCK DIAGRA
VCC GND REF + REF - CH0 CH1 * * * MUX AUTOCALIBRATION AND CONTROL
IN + IN -
-
CH15 COM
DIFFERENTIAL 3RD ORDER MODULATOR
Figure 1. Functional Block Diagram
TEST CIRCUITS
SDO 1.69k CLOAD = 20pF
SDO
Hi-Z TO VOH VOL TO VOH VOH TO Hi-Z
2440 TA03
APPLICATIO S I FOR ATIO
CONVERTER OPERATION Converter Operation Cycle
The LTC2444/LTC2445/LTC2448/LTC2449 are multichannel, high speed, delta-sigma analog-to-digital converters with an easy to use 3- or 4-wire serial interface (see Figure 1). Their operation is made up of three states. The converter operating cycle begins with the conversion, followed by the low power sleep state and ends with the data output/input (see Figure 2). The 4-wire interface consists of serial data input (SDI), serial data output (SDO), serial clock (SCK) and chip select (CS). The interface, timing, operation cycle and data out format is compatible with Linear's entire family of converters.
W
INTERNAL OSCILLATOR FO (INT/EXT)
U
W
U
U
U
U
+
SERIAL INTERFACE DECIMATING FIR ADDRESS
2444 F01
SDI SCK SDO CS
VCC 1.69k
CLOAD = 20pF
Hi-Z TO VOL VOH TO VOL VOL TO Hi-Z
2440 TA04
POWER UP IN+=CH0, IN-=CH1 OSR=256,1X MODE
CONVERT
SLEEP
CS = LOW AND SCK
CHANNEL SELECT SPEED SELECT DATA OUTPUT
2444 F02
Figure 2. LTC2444/LTC2445/LTC2448/LTC2449 State Transition Diagram
sn2444589 2444589fs
7
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
Initially, the LTC2444/LTC2445/LTC2448/LTC2449 perform a conversion. Once the conversion is complete, the device enters the sleep state. While in this sleep state, power consumption is reduced below 10A. The part remains in the sleep state as long as CS is HIGH. The conversion result is held indefinitely in a static shift register while the converter is in the sleep state. Once CS is pulled LOW, the device begins outputting the conversion result. There is no latency in the conversion result while operating in the 1x mode. The data output corresponds to the conversion just performed. This result is shifted out on the serial data out pin (SDO) under the control of the serial clock (SCK). Data is updated on the falling edge of SCK allowing the user to reliably latch data on the rising edge of SCK (see Figure 3). The data output state is concluded once 32 bits are read out of the ADC or when CS is brought HIGH. The device automatically initiates a new conversion and the cycle repeats. Through timing control of the CS, SCK and EXT pins, the LTC2444/LTC2445/LTC2448/LTC2449 offer several flexible modes of operation (internal or external SCK). These various modes do not require programming configuration registers; moreover, they do not disturb the cyclic operation described above. These modes of operation are described in detail in the Serial Interface Timing Modes section. Ease of Use The LTC2444/LTC2445/LTC2448/LTC2449 data output has no latency, filter settling delay or redundant data associated with the conversion cycle while operating in the 1X mode. There is a one-to-one correspondence between the conversion and the output data. Therefore, multiplexing multiple analog voltages is easy. Speed/ resolution adjustments may be made seamlessly between two conversions without settling errors. The LTC2444/LTC2445/LTC2448/LTC2449 perform offset and full-scale calibrations every conversion cycle. This calibration is transparent to the user and has no effect on the cyclic operation described above. The advantage of continuous calibration is extreme stability of offset and full-scale readings with respect to time, supply voltage change and temperature drift.
8
U
Power-Up Sequence The LTC2444/LTC2445/LTC2448/LTC2449 automatically enter an internal reset state when the power supply voltage VCC drops below approximately 2.2V. This feature guarantees the integrity of the conversion result and of the serial interface mode selection. When the VCC voltage rises above this critical threshold, the converter creates an internal power-on-reset (POR) signal with a duration of approximately 0.5ms. The POR signal clears all internal registers. The conversion immediately following a POR is performed on the input channel IN+ = CH0, IN- = CH1 at an OSR = 256 in the 1X mode. Following the POR signal, the LTC2444/LTC2445/LTC2448/ LTC2449 start a normal conversion cycle and follow the succession of states described above. The first conversion result following POR is accurate within the specifications of the device if the power supply voltage is restored within the operating range (4.5V to 5.5V) before the end of the POR time interval. Reference Voltage Range These converters accept a truly differential external reference voltage. The absolute/common mode voltage specification for the REF + and REF - pins covers the entire range from GND to VCC. For correct converter operation, the REF + pin must always be more positive than the REF - pin. The LTC2444/LTC2445/LTC2448/LTC2449 can accept a differential reference voltage from 0.1V to VCC. The converter output noise is determined by the thermal noise of the front-end circuits, and as such, its value in microvolts is nearly constant with reference voltage. A decrease in reference voltage will not significantly improve the converter's effective resolution. On the other hand, a reduced reference voltage will improve the converter's overall INL performance. Input Voltage Range The analog input is truly differential with an absolute/ common mode range for the CH0-CH15 and COM input pins extending from GND - 0.3V to VCC + 0.3V. Outside these limits, the ESD protection devices begin to turn on and the errors due to input leakage current increase rapidly. Within these limits, the LTC2444/LTC2445/
sn2444589 2444589fs
W
U
U
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
LTC2448/LTC2449 convert the bipolar differential input signal, VIN = IN+ - IN- (where IN+ and IN- are the selected input channels), from - FS = - 0.5 * VREF to +FS = 0.5 * VREF where VREF = REF+ - REF-. Outside this range, the converter indicates the overrange or the underrange condition using distinct output codes. MUXOUT/ADCIN There are two differences between the LTC2444/LTC2448 and the LTC2445/LTC2449. The first is the RMS noise performance. For a given OSR, the LTC2445/LTC2449 noise level is approximately 2 times lower (0.5 effective bits)than that of the LTC2444/LTC2448. The second difference is the LTC2445/LTC2449 includes MUXOUT/ADCIN pins. These pins enable an external buffer or gain block to be inserted between the output of the multiplexer and the input to the ADC. Since the buffer is driven by the output of the multiplexer, only one circuit is required for all 16 input channels. Additionally, the transparent calibration feature of the LTC244X family automatically removes the offset errors of the external buffer. In order to achieve optimum performance, the MUXOUT and ADCIN pins should not be shorted together. In applications where the MUXOUT and ADCIN need to be shorted together, the LTC2444/LTC2448 should be used because the MUXOUT and ADCIN are internally connected for optimum performance. Output Data Format The LTC2444/LTC2445/LTC2448/LTC2449 serial output data stream is 32 bits long. The first 3 bits represent status information indicating the sign and conversion state. The next 24 bits are the conversion result, MSB first. The remaining 5 bits are sub LSBs beyond the 24-bit level that may be included in averaging or discarded without loss of resolution. In the case of ultrahigh resolution modes, more than 24 effective bits of performance are possible (see Table 5). Under these conditions, sub LSBs are included in the conversion result and represent useful information beyond the 24-bit level. The third and fourth bit together are also used to indicate an underrange condition (the differential input voltage is below -FS) or an overrange condition (the differential input voltage is above +FS).
U
Bit 31 (first output bit) is the end of conversion (EOC) indicator. This bit is available at the SDO pin during the conversion and sleep states whenever the CS pin is LOW. This bit is HIGH during the conversion and goes LOW when the conversion is complete. Bit 30 (second output bit) is a dummy bit (DMY) and is always LOW. Bit 29 (third output bit) is the conversion result sign indicator (SIG). If VIN is >0, this bit is HIGH. If VIN is <0, this bit is LOW. Bit 28 (fourth output bit) is the most significant bit (MSB) of the result. This bit in conjunction with Bit 29 also provides the underrange or overrange indication. If both Bit 29 and Bit 28 are HIGH, the differential input voltage is above +FS. If both Bit 29 and Bit 28 are LOW, the differential input voltage is below -FS. The function of these bits is summarized in Table 1.
Table 1. LTC2444/LTC2445/LTC2448/LTC2449 Status Bits
Input Range VIN 0.5 * VREF 0V VIN < 0.5 * VREF -0.5 * VREF VIN < 0V VIN < - 0.5 * VREF Bit 31 Bit 30 Bit 29 Bit 28 EOC DMY SIG MSB 0 0 0 0 0 0 0 0 1 1 0 0 1 0 1 0
W
U
U
Bits 28-5 are the 24-bit conversion result MSB first. Bit 5 is the least significant bit (LSB). Bits 4-0 are sub LSBs below the 24-bit level. Bits 4-0 may be included in averaging or discarded without loss of resolution. Data is shifted out of the SDO pin under control of the serial clock (SCK), see Figure 3. Whenever CS is HIGH, SDO remains high impedance and SCK is ignored. In order to shift the conversion result out of the device, CS must first be driven LOW. EOC is seen at the SDO pin of the device once CS is pulled LOW. EOC changes real time from HIGH to LOW at the completion of a conversion. This signal may be used as an interrupt for an external microcontroller. Bit 31 (EOC) can be captured on the first rising edge of SCK. Bit 30 is shifted out of the device on the
sn2444589 2444589fs
9
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
CS 1 SCK 2 3 4 5 6 7 8 9 10 11 12 13 14 32
SDI
1
0
EN
SGL
ODD
BIT 31 BIT 30 BIT 29 BIT 28 BIT 27 BIT 26 BIT 25 BIT 24 BIT 23 BIT 22 BIT 21 Hi-Z SDO EOC "0" SIG MSB
BUSY
2444 F04
Figure 3. SDI Speed/Resolution, Channel Selection, and Data Output Timing
first falling edge of SCK. The final data bit (Bit 0) is shifted out on the falling edge of the 31st SCK and may be latched on the rising edge of the 32nd SCK pulse. On the falling edge of the 32nd SCK pulse, SDO goes HIGH indicating the initiation of a new conversion cycle. This bit serves as EOC (Bit 31) for the next conversion cycle. Table 2 summarizes the output data format. As long as the voltage on the IN+ and IN- pins is maintained within the - 0.3V to (VCC + 0.3V) absolute maximum operating range, a conversion result is generated for any differential input voltage VIN from -FS = -0.5 * VREF to +FS = 0.5 * VREF. For differential input voltages greater than +FS, the conversion result is clamped to the value corresponding to the +FS + 1LSB. For differential input voltages below -FS, the conversion result is clamped to the value corresponding to -FS - 1LSB.
Table 2. LTC2444/LTC2445/LTC2448/LTC2449 Output Data Format
Differential Input Voltage VIN * VIN* 0.5 * VREF** 0.5 * VREF** - 1LSB 0.25 * VREF** 0.25 * VREF** - 1LSB 0 -1LSB - 0.25 * VREF** - 0.25 * VREF** - 1LSB - 0.5 * VREF** VIN* < -0.5 * VREF** Bit 31 EOC 0 0 0 0 0 0 0 0 0 0 Bit 30 DMY 0 0 0 0 0 0 0 0 0 0 Bit 29 SIG 1 1 1 1 1 0 0 0 0 0 Bit 28 MSB 1 0 0 0 0 1 1 1 1 0 Bit 27 0 1 1 0 0 1 1 0 0 1 Bit 26 0 1 0 1 0 1 0 1 0 1 Bit 25 0 1 0 1 0 1 0 1 0 1 ... ... ... ... ... ... ... ... ... ... ... Bit 0 0 1 0 1 0 1 0 1 0 1
sn2444589 2444589fs
*The differential input voltage VIN = IN+ - IN-. **The differential reference voltage VREF = REF+ - REF-.
10
U
A2 A1 A0 OSR3 OSR2 OSR1 OSR0 TWOX BIT 0 LSB Hi-Z BIT 20 BIT 19
W
U
U
SERIAL INTERFACE PINS The LTC2444/LTC2445/LTC2448/LTC2449 transmit the conversion results and receive the start of conversion command through a synchronous 3- or 4-wire interface. During the conversion and sleep states, this interface can be used to assess the converter status and during the data output state it is used to read the conversion result and program the speed, resolution and input channel. Serial Clock Input/Output (SCK) The serial clock signal present on SCK (Pin 38) is used to synchronize the data transfer. Each bit of data is shifted out the SDO pin on the falling edge of the serial clock. In the Internal SCK mode of operation, the SCK pin is an output and the LTC2444/LTC2445/LTC2448/LTC2449 create their own serial clock. In the External SCK mode of operation, the SCK pin is used as input. The internal or
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
external SCK mode is selected by tying EXT (Pin 3) LOW for external SCK and HIGH for internal SCK. Serial Data Output (SDO) The serial data output pin, SDO (Pin 37), provides the result of the last conversion as a serial bit stream (MSB first) during the data output state. In addition, the SDO pin is used as an end of conversion indicator during the conversion and sleep states. When CS (Pin 36) is HIGH, the SDO driver is switched to a high impedance state. This allows sharing the serial interface with other devices. If CS is LOW during the convert or sleep state, SDO will output EOC. If CS is LOW during the conversion phase, the EOC bit appears HIGH on the SDO pin. Once the conversion is complete, EOC goes LOW. The device remains in the sleep state until the first rising edge of SCK occurs while CS = LOW. Chip Select Input (CS) The active LOW chip select, CS (Pin 36), is used to test the conversion status and to enable the data output transfer as described in the previous sections. In addition, the CS signal can be used to trigger a new conversion cycle before the entire serial data transfer has been completed. The LTC2444/LTC2445/LTC2448/ LTC2449 will abort any serial data transfer in progress and start a new conversion cycle anytime a LOW-to-HIGH transition is detected at the CS pin after the converter has entered the data output state. Serial Data Input (SDI) The serial data input (SDI, Pin 34) is used to select the speed/resolution and input channel of the LTC2444/ LTC2445/LTC2448/LTC2449. SDI is programmed by a serial input data stream under the control of SCK during the data output cycle, see Figure 3. Initially, after powering up, the device performs a conversion with IN+ = CH0, IN- = CH1, OSR = 256 (output rate
U
nominally 880Hz), and 1X speedup mode (no Latency). Once this first conversion is complete, the device enters the sleep state and is ready to output the conversion result and receive the serial data input stream programming the speed/resolution and input channel for the next conversion. At the conclusion of each conversion cycle, the device enters this state. In order to change the speed/resolution or input channel, the first 3 bits shifted into the device are 101. This is compatible with the programming sequence of the LTC2414/LTC2418. If the sequence is set to 000 or 100, the following input data is ignored (don't care) and the previously selected speed/resolution and channel remain valid for the next conversion. Combinations other than 101, 100, and 000 of the 3 control bits should be avoided. If the first 3 bits shifted into the device are 101, then the following 5 bits select the input channel for the following conversion (see Tables 3 and 4). The next 5 bits select the speed/resolution and mode 1X (no Latency) 2X (double output rate with one conversion latency), see Table 5. If these 5 bits are set to all 0's, the previous speed remains selected for the next conversion. This is useful in applications requiring a fixed output rate/resolution but need to change the input channel. In this case, the timing and input sequence is compatible with the LTC2414/LTC2418. When an update operation is initiated (the first 3 bits are 101) the first 5 bits are the channel address. The first bit, SGL, determines if the input selection is differential (SGL = 0) or single-ended (SGL = 1). For SGL = 0, two adjacent channels can be selected to form a differential input. For SGL = 1, one of 8 channels (LTC2444/LTC2445) or one of 16 channels (LTC2448/LTC2449) is selected as the positive input. The negative input is COM for all single ended operations. The remaining 4 bits (ODD, A2, A1, A0) determine which channel is selected. The LTC2448/ LTC2449 use all 4 bits to select one of 16 different input channels (see table 3) while in the case of the LTC2444/ LTC2445, A2 is always 0, and the remaining 3 bits select one of 8 different input channels (see Table 4).
sn2444589 2444589fs
W
UU
11
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
Table 3. Channel Selection for the LTC2448/LTC2449
MUX ADDRESS ODD/ SGL *0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SIGN 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 A2 A1 A0 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN- IN+ IN- IN+ IN- IN+ IN- IN+ IN- IN+ IN- IN+ IN- IN+ IN- IN+ IN- IN- IN- IN- IN- IN- IN- IN- IN- IN- IN- IN- IN- IN- IN- IN- 0 IN+ 1 IN- IN+ IN- IN+ IN- IN+ IN- IN+ IN- IN+ IN- IN+ IN- IN+ IN- 2 3 4 5 6 7 8 9 10 11 12 13 14 15 COM CHANNEL SELECTION
*Default at power up
12
U
sn2444589 2444589fs
W
U
U
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
MUX ADDRESS ODD/ SGL SIGN A2 A1 *0 0 00 0 0 00 0 0 01 0 0 01 0 1 00 0 1 00 0 1 01 0 1 01 1 0 00 1 0 00 1 0 01 1 0 01 1 1 00 1 1 00 1 1 01 1 1 01 *Default at power up
Table 4. Channel Selection for the LTC2444/LTC2445 (Bit A2 Should Always Be 0)
CHANNEL SELECTION A0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 IN+ 1 IN- 2 IN+ 3 IN- IN+ IN- IN+ IN- IN+ IN- IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN+ IN- IN+ IN- IN- IN- IN- IN- IN- IN- IN- IN- IN+ IN- 4 5 6 7 COM
U
sn2444589 2444589fs
W
U
U
13
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
OSR3 OSR2 OSR1 OSR0
Table 5. LTC2444/LTC2445/LTC2448/LTC2449 Speed/Resolution Selection
CONVERSION RATE RMS RMS TWOX INTERNAL EXTERNAL NOISE NOISE ENOB ENOB 9MHz 10.24MHz LTC2444/ LTC2445/ LTC2444/ LTC2445/ Clock Clock LTC2448 LTC2449 LTC2448 LTC2449 0 Keep Previous Speed/Resolution 0 3.52kHz 4kHz 23V 23V 17 17 0 1.76kHz 2kHz 4.4V 3.5V 20.1 20.1 0 880Hz 1kHz 2.8V 2V 20.8 21.3 0 440Hz 500Hz 2V 1.4V 21.3 21.8 0 220Hz 250Hz 1.4V 1V 21.8 22.4 0 110Hz 125Hz 1.1V 750nV 22.1 22.9 0 55Hz 62.5Hz 720nV 510nV 22.7 23.4 0 27.5Hz 31.25Hz 530nV 375nV 23.2 24 0 13.75Hz 15.625Hz 350nV 250nV 23.8 24.4 0 6.875Hz 7.8125Hz 280nV 200nV 24.1 24.6 1 Keep Previous Speed/Resolution 1 7.04kHz 8kHz 23V 23V 17 17 1 3.52kHz 4kHz 4.4V 3.5V 20.1 20.1 1 1.76kHz 2kHz 2.8V 2V 20.8 21.3 1 880Hz 1kHz 2V 1.4V 21.3 21.8 1 440Hz 500Hz 1.4V 1V 21.8 22.4 1 220Hz 250Hz 1.1V 750nV 22.1 22.9 1 110Hz 125Hz 720nV 510nV 22.7 23.4 1 55Hz 62.5Hz 530nV 375nV 23.2 24 1 27.5Hz 31.25Hz 350nV 250nV 23.8 24.4 1 13.75Hz 15.625Hz 280nV 200nV 24.1 24.6 OSR LATENCY
0 0 0 0 0 0 0 0 1 1 1 0 0 0 0 0 0 0 0 1 1 1
0 0 0 0 1 1 1 1 0 0 1 0 0 0 0 1 1 1 1 0 0 1
0 0 1 1 0 0 1 1 0 0 1 0 0 1 1 0 0 1 1 0 0 1
0 1 0 1 0 1 0 1 0 1 1 0 1 0 1 0 1 0 1 0 1 1
14
U
64 128 256 512 1024 2048 4096 8192 16384 32768 64 128 256 512 1024 2048 4096 8192 16384 32768 none none none none none none none none none none 1 cycle 1 cycle 1 cycle 1 cycle 1 cycle 1 cycle 1 cycle 1 cycle 1 cycle 1 cycle
sn2444589 2444589fs
W
UU
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
Speed Multiplier Mode
In addition to selecting the speed/resolution, a speed multiplier mode is used to double the output rate while maintaining the selected resolution. The last bit of the 5-bit speed/resolution control word (TWOX, see Table 5) determines if the output rate is 1X (no speed increase) or 2X (double the selected speed). While operating in the 1X mode, the device combines two internal conversions for each conversion result in order to remove the ADC offset. Every conversion cycle, the offset and offset drift are transparently calibrated greatly simplifying the user interface. The resulting conversion result has no latency. The first conversion following a newly selected speed/resolution and input channel is valid. This is identical to the operation of the LTC2440, LTC2414 and LTC2418. While operating in the 2X mode, the device performs a running average of the last two conversion results. This automatically removes the offset and drift of the device while increasing the output rate by 2X. The resolution (noise) remains the same. If a new channel is selected, the conversion result is valid for all conversions after the first conversion (one cycle latency). If a new speed/resolution is selected, the first conversion result is valid but the resolution (noise) is a function of the running average. All subsequent conversion results are valid. If the mode is changed from either 1X to 2X or 2X to 1X without changing the resolution or channel, the first conversion result is valid. If an external buffer/amplifier circuit is used for the LTC2445/LTC2449, the 2X mode can be used to increase the settling time of the amplifier between readings. While operating in the 2X mode, the multiplexer output (input to the external buffer/amplifier) is switched at the end of each conversion cycle. Prior to concluding the data out/in cycle, the analog multiplexer output is switched. This occurs at
Table 6. LTC2444/LTC2445/LTC2448/LTC2449 Interface Timing Modes
SCK Source External External Internal Internal Conversion Cycle Control CS and SCK SCK CS Continuous Data Output Control CS and SCK SCK CS Internal Connection and Waveforms Figures 4, 5 Figure 6 Figures 7, 8 Figure 9
sn2444589 2444589fs
Configuration External SCK, Single Cycle Conversion External SCK, 2-Wire I/O Internal SCK, Single Cycle Conversion Internal SCK, 2-Wire I/O, Continuous Conversion
U
the end of the conversion cycle (just prior to the data output cycle) for auto calibration. The time required to read the conversion enables more settling time for the external buffer/amplifier. The offset/offset drift of the external amplifier is automatically removed by the converter's auto calibration sequence for both the 1X and 2X speed modes. While operating in the 1X mode, if a new input channel is selected the multiplexer is switched on the falling edge of the 14th SCK (once the complete data input word is programmed). The remaining data output sequence time can be used to allow the external buffer/amplifier to settle. BUSY The BUSY output (Pin 2) is used to monitor the state of conversion, data output and sleep cycle. While the part is converting, the BUSY pin is HIGH. Once the conversion is complete, BUSY goes LOW indicating the conversion is complete and data out is ready. The part now enters the LOW power sleep state. BUSY remains LOW while data is shifted out of the device and SDI is shifted into the device. It goes HIGH at the conclusion of the data input/output cycle indicating a new conversion has begun. This rising edge may be used to flag the completion of the data read cycle. SERIAL INTERFACE TIMING MODES The LTC2444/LTC2445/LTC2448/LTC2449's 3- or 4-wire interface is SPI and MICROWIRE compatible. This interface offers several flexible modes of operation. These include internal/external serial clock, 3- or 4-wire I/O, single cycle conversion and autostart. The following sections describe each of these serial interface timing modes in detail. In all these cases, the converter can use the internal oscillator (FO = LOW) or an external oscillator connected to the FO pin. Refer to Table 6 for a summary.
W
UU
15
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
External Serial Clock, Single Cycle Operation (SPI/MICROWIRE Compatible) This timing mode uses an external serial clock to shift out the conversion result and a CS signal to monitor and control the state of the conversion cycle, see Figure 4. The serial clock mode is selected by the EXT pin. To select the external serial clock mode, EXT must be tied low. The serial data output pin (SDO) is Hi-Z as long as CS is HIGH. At any time during the conversion cycle, CS may be pulled LOW in order to monitor the state of the converter. While CS is pulled LOW, EOC is output to the SDO pin. EOC = 1 (BUSY = 1) while a conversion is in progress and EOC = 0 (BUSY = 0) if the device is in the sleep state. Independent of CS, the device automatically enters the low power sleep state once the conversion is complete.
2.7V TO 5.5V 1F 28 VCC LTC2448 REFERENCE VOLTAGE 0.1V TO VCC
* * *
29 30 8 15 16
* * *
ANALOG INPUTS
23 7
CS TEST EOC SCK (EXTERNAL) TEST EOC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 32
SDI
1
0
EN
SGL
BIT 31 BIT 30 BIT 29 BIT 28 BIT 27 BIT 26 BIT 25 BIT 24 BIT 23 BIT 22 BIT 21 Hi-Z SDO EOC "0" SIG MSB
BUSY CONVERSION SLEEP DATA OUTPUT CONVERSION
2444 F05
Figure 4. External Serial Clock, Single Cycle Operation
sn2444589 2444589fs
16
U
When the device is in the sleep state (EOC = 0), its conversion result is held in an internal static shift register. The device remains in the sleep state until the first rising edge of SCK is seen. Data is shifted out the SDO pin on each falling edge of SCK. This enables external circuitry to latch the output on the rising edge of SCK. EOC can be latched on the first rising edge of SCK and the last bit of the conversion result can be latched on the 32nd rising edge of SCK. On the 32nd falling edge of SCK, the device begins a new conversion. SDO goes HIGH (EOC = 1) and BUSY goes HIGH indicating a conversion is in progress. At the conclusion of the data cycle, CS may remain LOW and EOC monitored as an end-of-conversion interrupt. Alternatively, CS may be driven HIGH setting SDO to Hi-Z and BUSY monitored for the completion of a conversion.
FO 35 = EXTERNAL OSCILLATOR = INTERNAL OSCILLATOR REF + REF - CH0 * CH7 CH8 * CH15 COM
* * * *
W
UU
SDI SCK
34 38 4-WIRE SPI INTERFACE
SDO CS BUSY GND
37 36 2
1,4,5,6,31,32,33
ODD
A2
A1
A0
OSR3
OSR2
OSR1
OSR0
TWOX BIT 0 LSB Hi-Z
BIT 20 BIT 19
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO U
sequence is aborted prior to the 13th rising edge of SCK, the new input data is ignored, and the previously selected speed/resolution and channel are used for the next conversion cycle. This is useful for systems not requiring all 32 bits of output data, aborting an invalid conversion cycle or synchronizing the start of a conversion. If a new channel is being programmed, the rising edge of CS must come after the 14th falling edge of SCK in order to store the data input sequence.
VCC LTC2448 REFERENCE VOLTAGE 0.1V TO VCC
* * *
As described above, CS may be pulled LOW at any time in order to monitor the conversion status on the SDO pin. Typically, CS remains LOW during the data output state. However, the data output state may be aborted by pulling CS HIGH anytime between the fifth falling edge and the 32nd falling edge of SCK, see Figure 5. On the rising edge of CS, the device aborts the data output state and immediately initiates a new conversion. Thirteen serial input data bits are required in order to properly program the speed/resolution and input channel. If the data output
CS 1 SCK (EXTERNAL) 5 1 2 3 4 5 6 TEST EOC
SDI
DON'T CARE
SDO
BUSY DATA OUTPUT CONVERSION SLEEP CONVERSION DATA OUTPUT CONVERSION SLEEP
2444 F06
Figure 5. External Serial Clock, Reduced Output Data Length
W
U
U
2.7V TO 5.5V 1F 28 FO 35 = EXTERNAL OSCILLATOR = INTERNAL OSCILLATOR
29 30 8 15 16
* * *
REF + REF - CH0 * CH7 CH8 * CH15 COM
* * * *
SDI SCK
34 38 4-WIRE SPI INTERFACE
SDO CS BUSY GND
37 36 2
ANALOG INPUTS
23 7
1,4,5,6,31,32,33
DON'T CARE BIT 31 BIT 30 BIT 29 BIT 28 BIT 27 BIT 26 BIT 25 Hi-Z EOC "0" SIG MSB Hi-Z
DON'T CARE
sn2444589 2444589fs
17
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
External Serial Clock, 2-Wire I/O This timing mode utilizes a 2-wire serial I/O interface. The conversion result is shifted out of the device by an externally generated serial clock (SCK) signal, see Figure 6. CS may be permanently tied to ground, simplifying the user interface or isolation barrier. The external serial clock mode is selected by tying EXT LOW. Since CS is tied LOW, the end-of-conversion (EOC) can be continuously monitored at the SDO pin during the convert and sleep states. Conversely, BUSY (Pin 2) may be used to monitor the status of the conversion cycle. EOC or BUSY may be used as an interrupt to an external controller
2.7V TO 5.5V 1F 28 VCC LTC2448 REFERENCE VOLTAGE 0.1V TO VCC
* * *
29 30 8 15 16
* * *
ANALOG INPUTS
23 7
CS 1 SCK (EXTERNAL) 2 3 4 5 6 7 8 9 10 11 12 13 14 32
SDI
DON'T CARE
1
0
EN
SGL
BIT 31 BIT 30 BIT 29 BIT 28 BIT 27 BIT 26 BIT 25 BIT 24 BIT 23 BIT 22 BIT 21 SDO EOC "0" SIG MSB
BUSY CONVERSION SLEEP DATA OUTPUT CONVERSION
2444 F07
Figure 6. External Serial Clock, CS = 0 Operation (2-Wire)
18
U
indicating the conversion result is ready. EOC = 1 (BUSY = 1) while the conversion is in progress and EOC = 0 (BUSY = 0) once the conversion enters the low power sleep state. On the falling edge of EOC/BUSY, the conversion result is loaded into an internal static shift register. The device remains in the sleep state until the first rising edge of SCK. Data is shifted out the SDO pin on each falling edge of SCK enabling external circuitry to latch data on the rising edge of SCK. EOC can be latched on the first rising edge of SCK. On the 32nd falling edge of SCK, SDO and BUSY go HIGH (EOC = 1) indicating a new conversion has begun.
FO 35 = EXTERNAL OSCILLATOR = INTERNAL OSCILLATOR REF + REF - CH0 * CH7 CH8 * CH15 COM
* * * *
W
U
U
SDI SCK
34 38 4-WIRE SPI INTERFACE
SDO CS BUSY GND
37 36 2
1,4,5,6,31,32,33
ODD
A2
A1
A0
OSR3
OSR2
OSR1
OSR0
TWOX
DON'T CARE BIT 0 LSB
BIT 20 BIT 19
sn2444589 2444589fs
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
Internal Serial Clock, Single Cycle Operation This timing mode uses an internal serial clock to shift out the conversion result and a CS signal to monitor and control the state of the conversion cycle, see Figure 7. In order to select the internal serial clock timing mode, the EXT pin must be tied HIGH. The serial data output pin (SDO) is Hi-Z as long as CS is HIGH. At any time during the conversion cycle, CS may be pulled LOW in order to monitor the state of the converter. Once CS is pulled LOW, SCK goes LOW and EOC is output to the SDO pin. EOC = 1 while a conversion is in progress and EOC = 0 if the device is in the sleep state. Alternatively, BUSY (Pin 2) may be used to monitor the status of the conversion in progress. BUSY is HIGH during the conver2.7V TO 5.5V 28 1F REFERENCE VOLTAGE 0.1V TO VCC
* * *
VCC LTC2448
29 30 8 15 16
* * *
REF + REF - CH0 * CH7 CH8 * CH15 COM
* * * *
ANALOG INPUTS
23 7
SDI
DON'T CARE
1
0
EN
SGL
BIT 31 BIT 30 BIT 29 BIT 28 BIT 27 BIT 26 BIT 25 BIT 24 BIT 23 BIT 22 BIT 21 Hi-Z SDO EOC "0" SIG MSB
BUSY CONVERSION SLEEP DATA OUTPUT CONVERSION
2444 F08
Figure 7. Internal Serial Clock, Single Cycle Operation
U
sion and goes LOW at the conclusion. It remains LOW until the result is read from the device. When testing EOC, if the conversion is complete (EOC = 0), the device will exit the sleep state and enter the data output state if CS remains LOW. In order to prevent the device from exiting the low power sleep state, CS must be pulled HIGH before the first rising edge of SCK. In the internal SCK timing mode, SCK goes HIGH and the device begins outputting data at time tEOCtest after the falling edge of CS (if EOC = 0) or tEOCtest after EOC goes LOW (if CS is LOW during the falling edge of EOC). The value of tEOCtest is 500ns. If CS is pulled HIGH before time tEOCtest, the device remains in the sleep state. The conversion result is held in the internal static shift register.
FO 35 = EXTERNAL OSCILLATOR = INTERNAL OSCILLATOR SDI SCK 34 38 4-WIRE SPI INTERFACE SDO CS BUSY GND 2 1,4,5,6,31,32,33 37 36 ODD A2 A1 A0 OSR3 OSR2 OSR1 OSR0 TWOX DON'T CARE BIT 0 LSB Hi-Z BIT 20 BIT 19
sn2444589 2444589fs
W
UU
19
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
If CS remains LOW longer than tEOCtest, the first rising edge of SCK will occur and the conversion result is serially shifted out of the SDO pin. The data output cycle begins on this first rising edge of SCK and concludes after the 32nd rising edge. Data is shifted out the SDO pin on each falling edge of SCK. The internally generated serial clock is output to the SCK pin. This signal may be used to shift the conversion result into external circuitry. EOC can be latched on the first rising edge of SCK and the last bit of the conversion result on the 32nd rising edge of SCK. After the 32nd rising edge, SDO goes HIGH (EOC = 1), SCK stays HIGH and a new conversion starts. Typically, CS remains LOW during the data output state. However, the data output state may be aborted by pulling CS HIGH anytime between the first and 32nd rising edge
2.7V TO 5.5V 1F 28 VCC LTC2448 REFERENCE VOLTAGE 0.1V TO VCC
* * *
ANALOG INPUTS
* * *
SDI
DON'T CARE
BIT 31 BIT 30 BIT 29 BIT 28 BIT 27 BIT 26 BIT 25 SDO Hi-Z EOC "0" SIG MSB Hi-Z
BUSY DATA OUTPUT CONVERSION SLEEP CONVERSION DATA OUTPUT CONVERSION SLEEP
2444 F09
Figure 8. Internal Serial Clock, Reduced Data Output Length
sn2444589 2444589fs
20
U
of SCK, see Figure 8. On the rising edge of CS, the device aborts the data output state and immediately initiates a new conversion. This is useful for systems not requiring all 32 bits of output data, aborting an invalid conversion cycle, or synchronizing the start of a conversion. Thirteen serial input data bits are required in order to properly program the speed/resolution and input channel. If the data output sequence is aborted prior to the 13th rising edge of SCK, the new input data is ignored, and the previously selected speed/resolution and channel are used for the next conversion cycle. If a new channel is being programmed, the rising edge of CS must come after the 14th falling edge of SCK in order to store the data input sequence.
FO 35 = EXTERNAL OSCILLATOR = INTERNAL OSCILLATOR 29 30 8 15 16 23 7 REF + REF - CH0 * CH7 CH8 * CH15 COM
* * * *
W
U
U
SDI SCK
34 38 4-WIRE SPI INTERFACE
SDO CS BUSY GND
37 36 2
1,4,5,6,31,32,33
DON'T CARE
DON'T CARE
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
Internal Serial Clock, 2-Wire I/O, Continuous Conversion This timing mode uses a 2-wire, all output (SCK and SDO) interface. The conversion result is shifted out of the device by an internally generated serial clock (SCK) signal, see Figure 9. CS may be permanently tied to ground, simplifying the user interface or isolation barrier. The internal serial clock mode is selected by tying EXT HIGH. During the conversion, the SCK and the serial data output pin (SDO) are HIGH (EOC = 1) and BUSY = 1. Once the conversion is complete, SCK, BUSY and SDO go LOW (EOC = 0) indicating the conversion has finished and the
2.7V TO 5.5V 1F 28 VCC LTC2448 REFERENCE VOLTAGE 0.1V TO VCC
* * *
29 30 8 15 16
* * *
REF + REF - CH0 * CH7 CH8 * CH15 COM
* * * *
ANALOG INPUTS
23 7
CS 1 SCK 2 3 4 5 6 7 8 9 10 11 12 13 14 32
SDI
DON'T CARE
1
0
EN
SGL
ODD
BIT 31 BIT 30 BIT 29 BIT 28 BIT 27 BIT 26 BIT 25 BIT 24 BIT 23 BIT 22 BIT 21 SDO EOC "0" SIG MSB
BUSY CONVERSION SLEEP DATA OUTPUT CONVERSION
2444 F10
Figure 9. Internal Serial Clock, Continuous Operation
U
device has entered the low power sleep state. The part remains in the sleep state a minimum amount of time (500ns) then immediately begins outputting data. The data output cycle begins on the first rising edge of SCK and ends after the 32nd rising edge. Data is shifted out the SDO pin on each falling edge of SCK. The internally generated serial clock is output to the SCK pin. This signal may be used to shift the conversion result into external circuitry. EOC can be latched on the first rising edge of SCK and the last bit of the conversion result can be latched on the 32nd rising edge of SCK. After the 32nd rising edge, SDO goes HIGH (EOC = 1) indicating a new conversion is in progress. SCK remains HIGH during the conversion.
FO 35 = EXTERNAL OSCILLATOR = INTERNAL OSCILLATOR SDI SCK 34 38 4-WIRE SPI INTERFACE SDO CS BUSY GND 2 1,4,5,6,31,32,33 37 36 A2 A1 A0 OSR3 OSR2 OSR1 OSR0 TWOX DON'T CARE BIT 0 LSB BIT 20 BIT 19
sn2444589 2444589fs
W
U
U
21
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
Normal Mode Rejection and Antialiasing One of the advantages delta-sigma ADCs offer over conventional ADCs is on-chip digital filtering. Combined with a large oversampling ratio, the LTC2444/LTC2445/ LTC2448/LTC2449 significantly simplify antialiasing filter requirements. The LTC2444/LTC2445/LTC2448/LTC2449's speed/resolution is determined by the over sample ratio (OSR) of the on-chip digital filter. The OSR ranges from 64 for 3.5kHz output rate to 32,768 for 6.9Hz (in No Latency mode) output rate. The value of OSR and the sample rate fS determine the filter characteristics of the device. The first NULL of the digital filter is at fN and multiples of fN where fN = fS/OSR, see Figure 10 and Table 7. The rejection at the frequency fN 14% is better than 80dB, see Figure 11.
0 SINC4 ENVELOPE
NORMAL MODE REJECTION (dB)
NORMAL MODE REJECTION (dB)
-20 -40 -60 -80 -100 -120 -140 60 120 240 0 180 DIFFERENTIAL INPUT SIGNAL FREQUENCY (Hz)
2440 F11
Figure 10. LTC2444/LTC2445/LTC2448/LTC2449 Normal Mode Rejection (Internal Oscillator)
22
U
Table 7. OSR vs Notch Frequency (fN) (with Internal Oscillator Running at 9MHz)
OSR 64 128 256 512 1024 2048 4096 8192 16384 32768* *Simultaneous 50/60Hz rejection NOTCH (fN) 28.16kHz 14.08kHz 7.04kHz 3.52kHz 1.76kHz 880Hz 440Hz 220Hz 110Hz 55Hz
-80 -90 -100 -110 -120 -130 -140 47 49 51 53 55 57 59 61 63 DIFFERENTIAL INPUT SIGNAL FREQUENCY (Hz)
2440 F12
W
U
U
Figure 11. LTC2444/LTC2445/LTC2448/LTC2449 Normal Mode Rejection (Internal Oscillator)
sn2444589 2444589fs
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
If FO is grounded, fS is set by the on-chip oscillator at 1.8MHz 5% (over supply and temperature variations). At an OSR of 32,768, the first NULL is at fN = 55Hz and the no latency output rate is fN/8 = 6.9Hz. At the maximum OSR, the noise performance of the device is 280nVRMS (LTC2444/ LTC2448) and 200nVRMS (LTC2445/LTC2449) with better than 80dB rejection of 50Hz 2% and 60Hz 2%. Since the OSR is large (32,768) the wide band rejection is extremely large and the antialiasing requirements are simple. The first multiple of fS occurs at 55Hz * 32,768 = 1.8MHz, see Figure 12. The first NULL becomes fN = 7.04kHz with an OSR of 256 (an output rate of 880Hz) and FO grounded. While the NULL has shifted, the sample rate remains constant. As a result of constant modulator sampling rate, the linearity, offset and full-scale performance remains unchanged as does the first multiple of fS. The sample rate fS and NULL fN, may also be adjusted by driving the FO pin with an external oscillator. The sample rate is fS = fEOSC/5, where fEOSC is the frequency of the
0
NORMAL MODE REJECTION (dB)
-40 -60 1.8MHz -80 -100 REJECTION > 120dB -120 -140 1000000 2000000 0 DIFFERENTIAL INPUT SIGNAL FREQUENCY (Hz)
1440 F13
NORMAL MODE REJECTION (dB)
-20
Figure 12. LTC2444/LTC2445/LTC2448/LTC2449 Normal Mode Rejection (Internal Oscillator)
U
clock applied to FO. Combining a large OSR with a reduced sample rate leads to notch frequencies fN near DC while maintaining simple antialiasing requirements. A 100kHz clock applied to FO results in a NULL at 0.6Hz plus all harmonics up to 20kHz, see Figure 13. This is useful in applications requiring digitalization of the DC component of a noisy input signal and eliminates the need of placing a 0.6Hz filter in front of the ADC. An external oscillator operating from 100kHz to 20MHz can be implemented using the LTC1799 (resistor set SOT-23 oscillator), see Figure 16. By floating pin 4 (DIV) of the LTC1799, the output oscillator frequency is:
W
UU
10k fOSC = 10MHz * 10 * RSET The normal mode rejection characteristic shown in Figure 13 is achieved by applying the output of the LTC1799 (with RSET = 100k) to the FO pin on the LTC2444/LTC2445/ LTC2448/LTC2449 with SDI tied HIGH (OSR = 32768).
0 -20 -40 -60 -80 -100 -120 -140 2 4 6 10 0 8 DIFFERENTIAL INPUT SIGNAL FREQUENCY (Hz)
2440 F14
Figure 13. LTC2444/LTC2445/LTC2448/LTC2449 Normal Mode Rejection (External Oscillator at 90kHz)
sn2444589 2444589fs
23
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
Reduced Power Operation In addition to adjusting the speed/resolution of the LTC2444/LTC2445/LTC2448/LTC2449, the speed/resolution/power dissipation may also be adjusted using the automatic sleep mode. During the conversion cycle, the LTC2444/LTC2445/LTC2448/LTC2449 draw 8mA supply current independent of the programmed speed. Once the conversion cycle is completed, the device automatically enters a low power sleep state drawing 8A. The device remains in this state as long as CS is HIGH and data is not shifted out. By adjusting the duration of the sleep state (hold CS HIGH longer) and the duration of the conversion cycle (programming OSR) the DC power dissipation can be reduced, see Figure 14.
IREF+ VREF+ ILEAK IIN+ VIN+ ILEAK IIN - VIN - ILEAK IREF - VREF - ILEAK VCC ILEAK RSW (TYP) 500
2440 F16
VCC ILEAK RSW (TYP) 500
VCC ILEAK RSW (TYP) 500 MUX CEQ 5pF (TYP) (CEQ = 2pF SAMPLE CAP + PARASITICS)
VCC ILEAK RSW (TYP) 500 MUX
Figure 15. LTC2444/LTC2448 Input Structure
CONVERTER STATE
SLEEP DATA OUT
CONVERT
CS
SUPPLY CURRENT
8A
8mA
Figure 14. Reduced Power Timing Mode
sn2444589 2444589fs
24
U
Average Input Current The LTC2444/LTC2448 switch the input and reference to a 2pF capacitor at a frequency of 1.8MHz. A simplified equivalent circuit is shown in Figure 15. The sample capacitor for the LTC2445/LTC2449 is 4pF, and its average input current is externally buffered from the input source. The average input and reference currents can be expressed in terms of the equivalent input resistance of the sample capacitor, where: Req = 1/(fSW * Ceq) When using the internal oscillator, fSW is 1.8MHz and the equivalent resistance is approximately 110k.
SWITCHING FREQUENCY fSW = 1.8MHz INTERNAL OSCILLATOR fSW = fEOSC/5 EXTERNAL OSCILLATOR
SLEEP DATA OUT CONVERT SLEEP 8A 8mA 8A
2440 F15
W
U
U
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
Input Bandwidth and Frequency Rejection The combined effect of the internal SINC4 digital filter and the digital and analog autocalibration circuits determines the LTC2444/LTC2445/LTC2448/LTC2449 input bandwidth and rejection characteristics. The digital filter's response can be adjusted by setting the oversample ratio (OSR) through the SPI interface or by supplying an external conversion clock to the fo pin. Table 8 lists the properties of the LTC2444/LTC2445/ LTC2448/LTC2449 with various combinations of oversample ratio and clock frequency. Understanding these properties is the key to fine tuning the characteristics of the LTC2444/LTC2445/LTC2448/LTC2449 to the application. Maximum Conversion Rate The maximum conversion rate is the fastest possible rate at which conversions can be performed.
Table 8
Over- *RMS *RMS ENOB Maximum First Notch Effective -3dB sample Noise Noise (VREF = 5V) Conversion Rate Frequency Noise BW point (Hz) Ratio LTC2444/ LTC2445/ LTC2444/ LTC2445/ Internal External Internal External Internal External Internal External 9MHz clock fo 9MHz clock fo 9MHz clock fo (OSR) LTC2448 LTC2449 LTC2449 LTC2449 9MHz clock fo 64 128 256 512 1024 2048 4096 8192 16384 32768 23V 4.5V 2.8V 2V 1.4V 1.1V 720nV 530nV 350nV 280nV 23V 3.5V 2V 1.4V 1V 750nV 510nV 375nV 250nV 200nV 17 20.1 20.8 21.3 21.8 22.1 22.7 23.2 23.8 24.1 17 20 21.3 21.8 22.4 22.9 23.4 24 24.4 24.6 3515.6 1757.8 878.9 439.5 219.7 109.9 54.9 27.5 13.7 6.9 fo/2560 fo/5120 fo/10240 fo/20480 fo/40960 fo/81920 fo/163840 fo/327680 fo/655360 fo/1310720 28125 14062.5 7031.3 3515.6 1757.8 878.9 439.5 219.7 109.9 54.9 fo/320 fo/640 fo/1280 fo/2560 fo/5120 fo/1020 fo/2050 fo/4100 fo/8190 fo/16380 3148 1574 787 394 197 98.4 49.2 24.6 12.4 6.2 fo/5710 fo/2860 fo/1140 fo/2280 fo/4570 fo/9140 fo/18300 fo/36600 fo/73100 fo/146300 1696 848 424 212 106 53 26.5 13.2 6.6 3.3 fo/5310 fo/10600 fo/21200 fo/42500 fo/84900 fo/170000 fo/340000 fo/679000 fo/1358000 fo/2717000
*ADC noise increases by approximately 2 when OSR is decreased by a factor of 2 for OSR 32768 to OSR 256. The ADC noise at OSR 128 and OSR 64 include effects from internal modulator quantization noise.
U
First Notch Frequency This is the first notch in the SINC4 portion of the digital filter and depends on the fo clock frequency and the oversample ratio. Rejection at this frequency and its multiples (up to the modulator sample rate of 1.8MHz) exceeds 120dB. This is 8 times the maximum conversion rate. Effective Noise Bandwidth The LTC2444/LTC2445/LTC2448/LTC2449 has extremely good input noise rejection from the first notch frequency all the way out to the modulator sample rate (typically 1.8MHz). Effective noise bandwidth is a measure of how the ADC will reject wideband input noise up to the modulator sample rate. The example on the following page shows how the noise rejection of the LTC2444/LTC2445/ LTC2448/LTC2449 reduces the effective noise of an amplifier driving its input.
sn2444589 2444589fs
W
U
U
25
LTC2444/LTC2445/ LTC2448/LTC2449
APPLICATIO S I FOR ATIO
Example: If an amplifier (e.g. LT1219) driving the input of an LTC2444/LTC2445/LTC2448/LTC2449 has wideband noise of 33nV/Hz, band-limited to 1.8MHz, the total noise entering the ADC input is: 33nV/Hz * 1.8MHz = 44.3V. When the ADC digitizes the input, its digital filter filters out the wideband noise from the input signal. The noise reduction depends on the oversample ratio which defines the effective bandwidth of the digital filter. At an oversample of 256, the noise bandwidth of the ADC is 787Hz which reduces the total amplifier noise to: 33nV/Hz * 787Hz = 0.93V. The total noise is the RMS sum of this noise with the 2V noise of the ADC at OSR=256.
(0.93V)2 + (2uV)2 = 2.2V.
Increasing the oversample ratio to 32768 reduces the noise bandwidth of the ADC to 6.2Hz which reduces the total amplifier noise to: 33nV/Hz * 6.2Hz = 82nV. The total noise is the RMS sum of this noise with the 200nV noise of the ADC at OSR = 32768.
(82nV)2
+ (200nV)2 = 216nV.
In this way, the digital filter with its variable oversampling ratio can greatly reduce the effects of external noise sources.
4.5V TO 5.5V 1F 28 29 30 8 9 VCC BUSY 2 LTC1799 V+ OUT 0.1F 3-WIRE SPI INTERFACE GND RSET
REFERENCE VOLTAGE 0.1V TO VCC ANALOG INPUT -0.5VREF TO 0.5VREF
1,4,5,6,31,32,33
LTC2448 35 FO REF + 38 REF - SCK 37 CH0 SDO 36 CH1 CS * * * 3 EXT GND
Figure 16. Simple External Clock Source
sn2444589 2444589fs
26
U
Automatic Offset Calibration of External Buffers/Amplifiers The LTC2445/LTC2449 enable an external amplifier to be inserted between the multiplexer output and the ADC input. This enables one external buffer/amplifier circuit to be shared between all 17 analog inputs (16 single-ended or 8 differential). The LTC2445/LTC2449 perform an internal offset calibration every conversion cycle in order to remove the offset and drift of the ADC. This calibration is performed through a combination of front end switching and digital processing. Since the external amplifier is placed between the multiplexer and the ADC, it is inside the correction loop. This results in automatic offset correction and offset drift removal of the external amplifier. The LT1368 is an excellent amplifier for this function. It has rail-to-rail inputs and outputs, and it operates on a single 5V supply. Its open-loop gain is 1M and its input bias current is 10nA. It also requires at least a 0.1F load capacitor for compensation. It is this feature that sets it apart from other amplifiers--the load capacitor attenuates sampling glitches from the LTC2445/LTC2449 ADCIN terminals, allowing it to achieve full performance of the ADC with high impedance at the multiplexer inputs. Another benefit of the LT1368 is that it can be powered from supplies equal to or greater than that of the ADC. This can allow the inputs to span the entire absolute maximum of GND - 0.3V to VCC + 0.3V. Using a positive supply of 7.5V to 10V and a negative supply of -2.5 to -5V gives the amplifier plenty of headroom over the LTC2445/LTC2449 input range.
NC DIV SET
24448 F17
W
UU
LTC2444/LTC2445/ LTC2448/LTC2449
PACKAGE DESCRIPTIO U
UHF Package 38-Lead Plastic QFN (5mm x 7mm)
(Reference LTC DWG # 05-08-1701)
0.70 0.05 PACKAGE OUTLINE 0.25 0.05 0.50 BSC 5.20 0.05 (2 SIDES) 6.10 0.05 (2 SIDES) 7.50 0.05 (2 SIDES) RECOMMENDED SOLDER PAD LAYOUT 5.00 0.10 (2 SIDES) 0.75 0.05 0.00 - 0.05 3.15 0.10 (2 SIDES) 0.435 0.18 0.18 37 38 1 2 0.23 5.15 0.10 (2 SIDES) 0.40 0.10 0.200 REF 0.25 0.05 0.75 0.05 0.200 REF 0.00 - 0.05 0.50 BSC R = 0.115 TYP
(UH) QFN 0303
5.50 0.05 (2 SIDES) 4.10 0.05 (2 SIDES) 3.20 0.05 (2 SIDES)
PIN 1 TOP MARK (SEE NOTE 6)
7.00 0.10 (2 SIDES)
BOTTOM VIEW--EXPOSED PAD
NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE M0-220 VARIATION WHKD 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
sn2444589 2444589fs
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
27
LTC2444/LTC2445/ LTC2448/LTC2449
TYPICAL APPLICATIO U
External Buffers Provide High Impedance Inputs and Amplifier Offsets are Cancelled
LTC2449 17 CH0-CH15/ COM HIGH SPEED ADC SDI SCK SDO CS MUX
MUXOUTN
MUXOUTP
2
-
1/2 LT1368 1 0.22F
3
+
(EXTERNAL AMPLIFIERS) 5V 8 7 0.22F
2444589 TA05
6
- +
1/2 LT1368 5 4 0V
RELATED PARTS
PART NUMBER LT1025 LTC1043 LTC1050 LT1236A-5 LT1461 LTC1592 LTC1655 LTC1799 LTC2053 LTC2412 LTC2415 LTC2414/LTC2418 LTC2430/LTC2431 LTC2436-1 LTC2440 DESCRIPTION Micropower Thermocouple Cold Junction Compensator Dual Precision Instrumentation Switched Capacitor Building Block Precision Chopper Stabilized Op Amp Precision Bandgap Reference, 5V Micropower Series Reference, 2.5V Ultraprecise 16-Bit SoftSpan DAC 16-Bit Rail-to-Rail Micropower DAC Resistor Set SOT-23 Oscillator Rail-to-Rail Instrumentation Amplifier 2-Channel, Differential Input, 24-Bit, No Latency ADC 1-Channel, Differential Input, 24-Bit, No Latency ADC 4-/8-Channel, Differential Input, 24-Bit, No Latency ADC 1-Channel, Differential Input, 20-Bit, No Latency ADC 2-Channel, Differential Input, 16-Bit, No Latency ADC 1-Channel, Differential Input, High Speed/Low Noise, 24-Bit, No Latency ADC
TM
COMMENTS 80A Supply Current, 0.5C Initial Accuracy Precise Charge, Balanced Switching, Low Power No External Components 5V Offset, 1.6VP-P Noise 0.05% Max, 5ppm/C Drift 0.04% Max, 3ppm/C Max Drift Six Programmable Output Ranges 1LSB DNL, 600A, Internal Reference, SO-8 Single Resistor Frequency Set 10V Offset with 50nV/C Drift, 2.5VP-P Noise 0.01Hz to 10Hz 0.16ppm Noise, 2ppm INL, 200A 0.23ppm Noise, 2ppm INL, 2X Speed Up 0.2ppm Noise, 2ppm INL, 200A 0.56ppm Noise, 3ppm INL, 200A 800nVRMS Noise, 0.12LBS INL, 0.006LBS Offset, 200A 2VRMS Noise at 880Hz, 200nVRMS Noise at 6.9Hz, 0.0005% INL, Up to 3.5kHz Output Rate
SoftSpan is a trademark of Linear Technology Corporation.
sn2444589 2444589fs
ADCINN
ADCINP
28
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507
LT/TP 0304 1K * PRINTED IN USA
www.linear.com
(c) LINEAR TECHNOLOGY CORPORATION 2004

▲Up To Search▲

Price & Availability of LTC2444

	To Download LTC2444 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .